Heat dissipation technology in dcdc power supply module

With the development of miniaturization and micro-miniaturization of electronic components, high integration of integrated circuits and micro-assembly, the heat flux density of components and components has improved from time to time, and thermal design is also facing severe challenges. The quality of the heat dissipation structure of the power supply directly affects whether the power supply system can work stably for a long time. Based on heat transfer and fluid mechanics, the detailed structure of electronic equipment is separated, reasonable and efficient heat dissipation installation is designed, supplemented by advanced thermal analysis software simulation research, to invent a good working environment for electronic equipment and ensure heating components And the power system can work stably and reliably under the allowable temperature. This article will analyzedcdc power moduleCooling technology in China!

In order to ensure the stability of the dcdc power module and prolong the service life, the higher temperature of the chip must not exceed 85°C. Each time the operating temperature of the device increases by 10°C, its failure rate doubles. In order to ensure the safety of normal operation of electronic equipment and the reliability of long-term operation, appropriate and reliable methods are adopted to control the temperature of electronic components so that they do not exceed the higher temperature required for stable operation under the working environment conditions.

Thermal analysis process of dcdc power module

Analyze the thermal path corresponding to the power circuit, confirm the heat transfer path, and draw an equivalent thermal model.

Analyze the planning structure of the power supply circuit, and then determine the main heating components.

Use LSL to establish a 3D model of the power radiator, and then apply professional thermal simulation software EFD.Pro, based on the principles of fluid mechanics and numerical heat transfer, separate the actual thermal boundary conditions, and stop the simulation of the established model.

Stop analyzing the simulation results. After stopping the simulation of the model, analyze whether the simulation results can meet the requirements of the normal operation of the power supply.