Acdc power module potting requirements

The potting of the acdc power module is very important. This process not only involves the protection of the acdc power module (waterproof, moisture-proof, dust-proof, anti-corrosion, etc.), but also involves the thermal design of the acdc power module.

The commonly used potting materials for power modules are divided into three categories: epoxy resin, polyurethane and silicone rubber

Epoxy resin cannot be used for encapsulation of stress-sensitive and chip-containing modules due to its hardness, and is basically eliminated in module power supplies. However, due to its low cost, this epoxy resin is still used in micro-power power supplies with higher cost requirements. Some domestic poor power supply manufacturers also use this epoxy resin for acdc power supply modules. However, due to stress problems, the failure rate of this power supply is very high, and buyers are miserable.

Nowadays, the most commonly used in the potting of the power module of Fulaixiang is to use the addition molding silica gel for potting. This kind of silica gel is generally 1:1 ratio, which is convenient for operation. When designing the acdc power module for potting, pay attention to its heat conduction. Coefficient. However, the bonding ability is not strong and can be improved by using a primer.

Polyurethane has been used in China for a period of time, but due to its high hardness and inconvenient maintenance, coupled with the price reduction factor of silicone rubber, polyurethane is not cost-effective. Basically no application in China