Secrets of dcdc power module package selection

At oncedcdc module power supplyIn terms of product promotion, the same package often faces different power conditions, so it is very important to choose a suitable converter module power package. Then, what matters should be paid attention to when selecting the package of dcdc module power supply to achieve better results?

The external dimensions and output forms of the dcdc module power supply vary greatly. Low-power products use a sealed shell, which is very small in appearance; high-power products often use quarter-brick or half-brick forms, with circuits or exposed or wrapped in shells.

When choosing, you need to pay attention to the following two aspects: First, whether the pins are on the same plane. Second, is it easy to weld.

SMT converters must meet the requirements of the IEC191-6:1990 standard, which strictly limits the coplanarity of SMT device pins. The non-coplanarity of the device pins will cause difficulty in positioning the device during assembly, which will seriously affect the welding quality and increase the defective rate. The SMT type converter should be able to withstand the specified welding conditions. For most modern assembly lines, the device must meet the reflow soldering requirements specified by the CEC00802 standard, that is, the surface temperature of the device can exceed 300°C. If the converter cannot meet this requirement, a special welding assembly process needs to be designed for it, which will increase assembly time and increase production costs.

As far as the products of the same company are concerned, the same power products have different packages, and the same package has different powers, so how to choose the package form?

1. Under certain power conditions, the smaller the volume, the better. In the process of packaging, the reduction in size means the expansion of space, so as to provide more space for other parts of the system and ensure the integrity of the function.

2. When choosing packaging, try to choose products that meet international standards. Since international standards are formulated and required for global manufacturers, they have high requirements and good compatibility. In addition, there are also many manufacturers adopting this standard internationally, and there is a wider choice of supply options, which will not cause selection limitations.

3. When choosing packaging, we should focus on products with scalability to facilitate system expansion and upgrades in the future. On the basis of meeting the international requirements, the packaging mode widely used in the industry is half-brick and full-brick packaging.

The package of dcdc module power supply will increase the power requirements of the system due to functional upgrades. If the dcdc module power package remains unchanged, the design of the system circuit board does not need to be changed, which simplifies product upgrades and saves time.